Sci Rep 2020 Jul 24;10(1):12432. Epub 2020 Jul 24.
Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 10607, Taiwan.
This is the first report on the coating of diamond dicing blades with metallic glass (MG) coating to reduce chipping when used to cut Si, SiC, sapphire, and patterned sapphire substrates (PSS). The low coefficient-of-friction (CoF) of Zr-based MG-coated dicing blades was shown to reduce the number and size of chips, regardless of the target substrate. Overall, SiC, sapphire and PSS were most affected by chipping, due to the fact that higher cutting forces were needed for the higher hardness of SiC, sapphire and PSS. Read More