Electrodeposition of Gold to Conformally Fill High Aspect Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols.

J Surf Eng Mater Adv Technol 2015 Oct 16;5(4):207-213. Epub 2015 Oct 16.

Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.

Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of x-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.

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Source
http://dx.doi.org/10.4236/jsemat.2015.54022DOI Listing
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC4812826PMC
October 2015
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