Publications by authors named "Dongjun Fang"

4 Publications

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Disintegrable, transparent and mechanically robust high-performance antimony tin oxide/nanocellulose/polyvinyl alcohol thermal insulation films.

Carbohydr Polym 2021 Aug 7;266:118175. Epub 2021 May 7.

State Key Lab of Pulp and Paper Engineering, South China University of Technology, Guangzhou 510640, China. Electronic address:

Polymer-based thermal insulation films are widely utilized to reduce the influence of solar radiation. However, current thermal insulation films face several challenges from poor thermal insulation performance and severe environmental pollution, which are caused by the non-disintegratability of polymer substrates. Here, cellulose nanofiber (CNF)/antimony tin oxide (ATO) hybrid films with and without polyvinyl alcohol (PVA) are presented and they can be used as window thermal barrier films and personal thermal management textiles. The hybrid films exhibit prominent thermal insulation performance, blocking 91.07% ultraviolet(UV) light, reflecting 95.19% near-infrared(NIR) light, and transmitting 44.89% visible(VIS) light. Meanwhile, the hybrid films demonstrate high thermal stability, high anti-UV aging stability, and robust mechanical properties. Moreover, the used-up hybrid films based on natural cellulose are of high disintegratability and recyclability. Our present work is anticipated to open up a new avenue for the fabrication of next-generation high-performance thermal insulation films with sustainable and environmentally friendly processes.
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http://dx.doi.org/10.1016/j.carbpol.2021.118175DOI Listing
August 2021

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics.

Macromol Rapid Commun 2020 Oct 24;41(19):e2000292. Epub 2020 Aug 24.

State Key Lab of Pulp and Paper Engineering, South China University of Technology, Guangzhou, 510640, China.

Flexible electronics require its substrate to have adequate thermal stability, but current thermally stable polymer substrates are difficult to be disintegrated and recycled; hence, generate enormous electronic solid waste. Here, a thermally stable and green solvent-disintegrable polymer substrate is developed for flexible electronics to promote their recyclability and reduce solid waste generation. Thanks to the proper design of rigid backbones and rational adjustments of polar and bulky side groups, the polymer substrate exhibits excellent thermal and mechanical properties with thermal decomposition temperature (T ) of 430 °C, upper operating temperature of over 300 °C, coefficient of thermal expansion of 48 ppm K , tensile strength of 103 MPa, and elastic modulus of 2.49 GPa. Furthermore, the substrate illustrates outstanding optical and dielectric properties with high transmittance of 91% and a low dielectric constant of 2.30. Additionally, it demonstrates remarkable chemical and flame resistance. A proof-of-concept flexible printed circuit device is fabricated with this substrate, which demonstrates outstanding mechanical-electrical stability. Most importantly, the substrate can be quickly disintegrated and recycled with alcohol. With outstanding thermally stable properties, accompanied by excellent recyclability, the substrate is particularly attractive for a wide range of electronics to reduce solid waste generation, and head toward flexible and "green" electronics.
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http://dx.doi.org/10.1002/marc.202000292DOI Listing
October 2020

Highly Transparent, Highly Thermally Stable Nanocellulose/Polymer Hybrid Substrates for Flexible OLED Devices.

ACS Appl Mater Interfaces 2020 Feb 14;12(8):9701-9709. Epub 2020 Feb 14.

CAS Key Laboratory for Biomedical Effects of Nanomaterials and Nanosafety, CAS Center for Excellence in Nanoscience , National Center for Nanoscience and Technology , Beijing 100190 , China.

Flexible organic light-emitting diode (OLED) devices based on polymer substrates have attracted worldwide attention. However, the current OLED polymer substrates are limited due to weak thermal stability, which is not compatible with the high temperature in OLED fabrication. Here, we developed a novel nanocellulose/polyarylate (PAR) hybrid polymer substrate with both high transparency and excellent thermal properties. Benefiting from the nanometer scale of the cellulose nanofibrils (CNFs) and the efficient interfacial interaction with PAR, the substrate exhibited greatly improved thermal stability, with a glass transition temperature of 192 °C, the thermal decomposition temperature of 501 °C, and upper operating temperature up to over 220 °C. Meanwhile, the hybrid substrate exhibits outstanding mechanical properties. Notably, no apparent transparency loss was observed after the CNF addition, and the hybrid substrate maintains a high transmittance of 85% and a low haze of 1.75%@600 nm. Moreover, OLED devices fabricated on the hybrid substrates exhibit a much improved optoelectrical performance than that of the devices fabricated on the conventional poly(ethylene terephthalate) (PET) substrates. We anticipate this research will open up a new route for fabricating flexible high-performance OLEDs.
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http://dx.doi.org/10.1021/acsami.0c01048DOI Listing
February 2020

Binding Conductive Ink Initiatively and Strongly: Transparent and Thermally Stable Cellulose Nanopaper as a Promising Substrate for Flexible Electronics.

ACS Appl Mater Interfaces 2019 Jun 24;11(22):20281-20290. Epub 2019 May 24.

State Key Lab of Pulp and Paper Engineering , South China University of Technology , Guangzhou 510640 , China.

For flexible electronics, the substrates play key roles in ensuring their performance. However, most substrates suffer from weak bonding with the conductive ink and need additional aids. Here, inspired by the Ag-S bond theory, a novel cellulose nanopaper substrate is presented to improve the bond strength with the Ag nanoparticle ink through a facile printing method. The substrate is fabricated using thiol-modified nanofibrillated cellulose and exhibits excellent optical properties (∼85%@550 nm), ultra-small surface roughness (3.47 nm), and high thermal dimensional stability (up to at least 90 °C). Most importantly, it can attract Ag nanoparticles initiatively and bind them firmly, which enable the conductive ink to be printed without using the ink binder and form a strong substrate-ink bonding and maintain a stable conductivity of 2 × 10 Ω cm even after extensive peeling and bending. This work may lead to exploring new opportunities to fabricate high-performance flexible electronics using the newly developed nanopaper substrate.
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http://dx.doi.org/10.1021/acsami.9b04596DOI Listing
June 2019
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